Pixel 9 Pro XL

Pixel 9 Pro XL: processor, RAM, modem and selected component evidence

Sources reviewed: 2026-10-21

This independently written selection covers twelve component roles on the Pixel 9 Pro XL board pictured in iFixit's August 29, 2024 chip-ID guide. The guide identifies a 16GB Micron RAM package and 128GB Samsung storage package; it does not establish the sales region, retail SKU or production batch, and this page does not independently measure configured usable capacity. Google's August 13 announcement separately confirms Tensor G4 and 16GB system RAM for the Pro XL. Pixel 9, the smaller Pro, Pro Fold, other capacities and later boards are outside this sample map.

• Tensor G4, the modem and security chips answer different questions

  Google describes Tensor G4 as its custom silicon for the Pixel 9 family. iFixit separately identifies Google's Titan M2 security coprocessor and Samsung's S5400 Exynos Modem 5400 on this Pro XL board. An application processor runs the phone's main workload; the cited modem and security entries are distinct roles. A Samsung modem marking is not evidence that Samsung designed Tensor, nor does either source establish the Tensor foundry, packaging contractor or every radio component.

  Sources: [2][1]

• 16GB RAM and 128GB storage are separate resources

  The pictured Micron package is identified as 16GB LPDDR5, while the Samsung package is identified as 128GB NAND with a UFS 3.1 controller. Google independently lists 16GB RAM for the Pro XL. Working memory and saved-data storage are different resources; a larger storage option does not establish more RAM or the same storage vendor. We retain this sample's package names without applying its UFS version or vendor to other capacities and regions.

  Sources: [1][2]

• Why a charging IC does not identify the battery supplier

  The selected Analog Devices, Cirrus Logic and Renesas entries describe power management, wired charging and wireless power functions. Those board-level identifications do not establish who made the battery cells, battery pack or charging accessories. Similarly, identifying an NFC or USB interface chip does not settle the panel, camera or connector manufacturer. Keeping these roles separate makes the map useful without filling evidence gaps with plausible-sounding suppliers.

  Sources: [1]

Sources

1. iFixit: Google Pixel 9 Pro XL Chip ID — pictured board identifications — 2024-08-29
2. Google: Pixel 9 family announcement — Tensor G4, system RAM and availability — 2024-08-13

Each rectangle or flow counts one selected component role. Multiple roles from Samsung or Google remain separate records, not supplier market share, cost or physical package quantity. Manufacturing locations remain Unknown.