Nintendo Switch 2 suppliers and component map

Nintendo Switch 2: chip, RAM, storage and assembly evidence

Sources reviewed: 2026-10-16

This independently written selection combines Nintendo's official Switch 2 specifications (a custom processor made by NVIDIA, a 7.9-inch 1920x1080 LCD and 256GB of UFS storage) with component identifications from iFixit's June 10, 2025 chip-ID guide and TechInsights' teardown summary published January 23, 2026. Neither teardown states the unit's sales region or production batch. A Samsung 8N-class process for the T239 comes from independent die analysis of an engineering board reported by Tom's Hardware; Nintendo and NVIDIA have not confirmed the foundry. Final-assembly rows are Bloomberg reports based on industry sources and customs data, not Nintendo disclosures.

• NVIDIA designs the chip; the foundry is a reported finding

  Nintendo's specifications say the CPU/GPU is a custom processor made by NVIDIA, and NVIDIA describes a custom processor with RT Cores and Tensor Cores. iFixit reads the package as NVIDIA GMLX30-A1. Independent die analysis of an engineering board, reported by Tom's Hardware, found the T239 codename on the die and a customized Samsung 8N-class process. That last point is reported, not officially confirmed.

  Sources: [1][3][4][6]

• 12GB of RAM, 6GB packages and more than one memory vendor

  TechInsights lists two 6GB LPDDR5X packages from SK hynix, 12GB in total. iFixit's chip-ID guide identifies a Micron 6GB package on its board instead. Both can be true for different units: consoles are often multi-sourced. The map keeps both records, scoped to their samples, rather than naming one universal memory supplier.

  Sources: [5][4][6]

• Who builds the console is separate from who makes its chips

  Nintendo does not name its assemblers. Bloomberg reports that the Switch 2 is manufactured mainly in China by partners including Foxconn, and that Hosiden, one of three main assemblers, shipped consoles to the US from Vietnam. These are assembly relationships; they do not locate where the NVIDIA, memory or storage chips themselves are made.

  Sources: [7][8][9]

Sources

1. Nintendo: Switch 2 technical specifications — Accessed 2026-10-16; publication date not stated
2. Nintendo: Switch 2 release announcement and specifications — 2025-04-02
3. NVIDIA: custom processor in Nintendo Switch 2 — 2025-04-03
4. iFixit: Nintendo Switch 2 Chip ID — first-hand board identification — 2025-06-10
5. TechInsights teardown summary (Electronics360) — 2026-01-23
6. Tom's Hardware: T239 die analysis — Samsung 8N-class process (reported) — 2025-05-07
7. Bloomberg via The Japan Times: made mainly in China by partners including Foxconn — 2025-06-11
8. Bloomberg: Hosiden, one of three main Switch 2 assemblers, ships from Vietnam — 2025-04-10
9. The Verge: quotes Bloomberg's Hosiden customs-data report — 2025-04-10

Each colored rectangle and flow counts one selected record, not cost, market share or chip quantity. Rows marked reported rely on die analysis or news reporting rather than a first-hand board identification. Blank locations mean Unknown; only the two Bloomberg-reported assembly countries are located.